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Discussion on Technical Requirements for Through-Hole Reflow Soldering

2026-08-17

Pin-in-paste reflow soldering is an emerging technology in international electronic assembly applications. When a PCB has both surface-mount components and a small number of through-hole components such as sockets on the same side, we typically adopt the approach of first placing the surface-mount components through the reflow oven, then manually inserting the through-hole components and passing them through wave soldering. However, if pin-in-paste reflow soldering technology is used, it is only necessary to insert the through-hole components after the surface-mount placement is completed and before entering the reflow oven, and then pass everything through the reflow oven together.

PCBA Lecture Hall: Should the reflow oven temperature curve use RSS or RTS type?

2026-08-17

Should the reflow temperature profile be set to the RSS type (saddle type) or the RTS type (ramp-soak-spike type)? TESDATA has found that many PCBA engineers are constantly troubled by this question, because some bosses require using RTS, but they themselves feel uneasy about it.

Further Discussion on Setting the Lead-Free Reflow Soldering Temperature Profile

2026-08-17

In terms of backward compatibility, some components have only undergone lead-free surface treatment. For component suppliers, it is not cost-effective to provide both tin-lead and lead-free versions of the same component.

Vietnam GEIMS Electronics Intelligent Manufacturing Exhibition

2026-08-17

Global Sources will launch the "Global Sources Vietnam Electronic Smart Manufacturing Exhibition" from November 28-30, 2024, at the ICE International Exhibition Center in Hanoi, Vietnam, serving Vietnam's electronic manufacturing industry with a focus on the production stages of finished product assembly and testing and measurement. It facilitates factories in Vietnam's local consumer electronics, mobile electronics, new energy, smart home, medical devices, automotive, and other fields to source electronic components, wire harnesses and cables, PCBA, assembly testing and measurement equipment, injection molds, precision metal processing (parts), etc.; providing a "one-stop" visiting and procurement service.

2024 Asia Electronics Production Equipment & Microelectronics Industry Exhibition - Shenzhen

2026-08-17

At this grand event, Huiyimiao Electronic Technology (TESDATA brand) made meticulous preparations and showcased a series of market-proven and well-received main product models, shining brightly at booth 11G50 in the bustling Hall 11. At the exhibition site, TESDATA's new magnetic suction furnace temperature tester quickly attracted the attention of major exhibitors with its unique design concept and outstanding performance, becoming the focal point of the entire venue. This tester, with its innovative magnetic suction mounting method, not only offers easy operation but also achieves a qualitative leap in accuracy and stability, bringing a brand-new solution to the industrial temperature measurement field. Meanwhile, Huiyimiao Electronic Technology also displayed its intelligent real-time monitoring systems for wave soldering, reflow soldering, and vacuum furnaces, all of which employ advanced technology and data processing algorithms to achieve precise control and real-time monitoring of furnace temperatures, effectively improving production efficiency and product quality. The debut of these intelligent solutions not only demonstrated Huiyimiao Electronic Technology's deep expertise and technical strength in furnace temperature monitoring but also attracted numerous visiting customers to stop and observe. At the booth, the staff of Huiyimiao Electronic Technology warmly received every customer who came to inquire, patiently answering their questions, detailing the functions and advantages of the products, and demonstrating the operation processes and practical effects on-site. After gaining a deeper understanding, many customers showed strong interest and a keen willingness to cooperate with Huiyimiao Electronic Technology's products, engaging in in-depth discussions and exchanges with the staff to explore future cooperation opportunities and development prospects. Throughout the exhibition, Huiyimiao Electronic Technology's booth remained bustling and lively, becoming a bright highlight of the event.

2024 Step-by-Step New Technology Seminar

2026-08-17

At this grand event, Huiyimiao Electronic Technology (TESDATA brand) made meticulous preparations and showcased a series of market-proven and recognized main product models at the seminar. At the seminar site, TESDATA's new magnetic suction furnace temperature tester quickly attracted the attention of major exhibitors with its unique design concept and outstanding performance, becoming the focal point of the entire venue.
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