I. Introduction to SMT Technology
Surface Mount Technology (abbreviated as SMT) is a new generation of electronic assembly technology. It compresses traditional electronic components into devices only a fraction of their original size, thereby achieving high-density, high-reliability, miniaturized, and low-cost assembly of electronic products, as well as automated production. These miniaturized components are called SMD devices (or SMC, chip components). The process method of assembling components onto printed circuit boards (or other substrates) is referred to as the SMT process. The related assembly equipment is called SMT equipment.
Currently, advanced electronic products, especially in computers and communication electronics, have widely adopted SMT technology. Internationally, the output of SMD devices increases year by year, while the output of traditional devices decreases year by year. Therefore, over time, SMT technology will become increasingly prevalent.
? ? Or in other words: SMT is the abbreviation for Surface Mounted Technology, which is currently the most popular technology and process in the electronic assembly industry.
II. What are the characteristics of SMT
High assembly density, small size and light weight of electronic products. The volume and weight of SMD components are only about 1/10 of traditional through-hole components. Generally, after adopting SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%.
High reliability and strong vibration resistance. Low solder joint defect rate.
Good high-frequency characteristics. Reduced electromagnetic and radio frequency interference.
Easy to automate, improving production efficiency. Reducing costs by 30% to 50%. Saving materials, energy, equipment, labor, time, etc.
III. Why use SMT
Electronic products pursue miniaturization, and the previously used through-hole plug-in components can no longer be reduced in size;
Electronic products have more complete functions, and the integrated circuits (ICs) used no longer have through-hole components. Especially large-scale, highly integrated ICs must use surface mount components;
Mass production and automated production require manufacturers to produce high-quality products at low cost and high output to meet customer needs and enhance market competitiveness;
The development of electronic components, the development of integrated circuits (ICs), and the diverse applications of semiconductor materials;
The electronic technology revolution is inevitable, pursuing international trends.
