2024 Asia Electronics Production Equipment & Microelectronics Industry Exhibition - Shenzhen

NEPCON ASIA (Asia Electronics Production Equipment and Microelectronics Industry Exhibition) is a renowned professional exhibition in the Asian electronics manufacturing industry. It brings together buyers from all categories of electronics production enterprises across Asia, comprehensively presenting cross-industry advanced production solutions such as global PCB assembly, smart factories, semiconductor packaging and testing, automotive electronics, and touch and display, fostering commercial cooperation across the upstream and downstream industry chain, and comprehensively enhancing the global competitiveness of Asian electronics manufacturing enterprises.

NEPCON ASIA 2024 will be held from November 6-8, 2024 at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall). It will be jointly held with the Smart Factory and Automation Technology Exhibition S-FACTORY EXPO, IC Packaging Fair Semiconductor Packaging Technology Exhibition, Shenzhen Electronic Components and Materials Procurement Exhibition ES SHOW, AUTOMOTIVE WORLD CHINA, Shenzhen International Full Touch and Display Exhibition C-TOUCH & DISPLAY SHENZHEN, and Shenzhen International Film and Tape Exhibition FILM & TAPE EXPO, with eight halls working together to create a super exhibition feast for the electronics industry covering 160,000 square meters.

Huiyimiao Electronic Technology (TESDATA brand) made meticulous preparations at this grand event, bringing a series of main product models that have been tested and recognized by the market, and made a brilliant appearance at booth 11G50 in the bustling Hall 11. At the exhibition site, TESDATA's new magnetic suction reflow oven temperature tester quickly attracted the attention of various exhibitors with its unique design concept and excellent performance, becoming the focus of the entire venue. With its innovative magnetic suction mounting method, this tester is not only easy to operate, but also achieves a qualitative leap in accuracy and stability, bringing a brand-new solution to the industrial temperature measurement field. At the same time, Huiyimiao Electronic Technology also showcased its intelligent real-time monitoring systems for wave soldering, reflow soldering, and vacuum furnace temperatures. These systems adopt advanced technology and data processing algorithms, enabling precise control and real-time monitoring of furnace temperatures, effectively improving production efficiency and product quality. The debut of these intelligent solutions not only demonstrated Huiyimiao Electronic Technology's deep accumulation and technical strength in the field of furnace temperature monitoring, but also attracted many visiting customers to stop and observe. At the booth, the staff of Huiyimiao Electronic Technology warmly received every customer who came to inquire, patiently answering their questions, introducing the functions and advantages of the products in detail, and demonstrating the operation process and actual effects of the products on site. After in-depth understanding, many customers showed strong interest and a strong willingness to cooperate in Huiyimiao Electronic Technology's products, and engaged in in-depth negotiations and exchanges with the staff, jointly exploring future cooperation opportunities and development prospects. Throughout the exhibition, Huiyimiao Electronic Technology's booth was always bustling and lively, becoming a bright highlight of this exhibition.