Blog

Surface Mount Technology (abbreviated as SMT) is a new generation of electronic assembly technology that compresses traditional electronic components into devices only a fraction of their original size, thereby achieving high-density, high-reliability, miniaturization, low-cost electronic product assembly, as well as automated production.

Wave soldering refers to the process where molten soft solder (lead-tin alloy) is pumped by an electric or electromagnetic pump to form a solder wave as required by design, or alternatively formed by injecting nitrogen gas into the solder bath, allowing the printed circuit board pre-assembled with components to pass through the solder wave, thereby achieving mechanical and electrical connections between component terminals or leads and the PCB pads through soft soldering.

The engineer establishes a reasonable temperature curve testing range based on the solder paste model, special component specifications, special measurement positions, FPC process, and customer requirements, including specific parameters and definitions for the preheat zone, soak (constant temperature) zone, reflow zone, and cooling zone.