Discussion on the technical requirements of perforated reflow soldering Perforated reflow is an emerging technology in international electronics assembly applications. When there are both mounting components on the same side of the PCB and a small number of sockets and other components, we generally take the method of first patching through the reflow oven and then manually inserting the wave soldering.
CSP and flip chip assembly using viscous flux (2) After mounting, the board is soldered and the components are electrically tested. The daisy chain measurement results are shown in Figure 2 by a dashed line. The theoretical tolerance position of the solder mask is also shown in the figure.